发明名称 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
摘要 <p>[Problems] In an electronic component and a method of manufacturing the same, forming a finer conductive pattern than conventional counterpart [Means of Solving] A method of manufacturing an electronic component includes the steps of forming a resin layer over an underlying layer, pressing a conductor plate including a pattern formed on one major surface thereof against the resin layer, and embedding the pattern in the resin layer, and performing polishing, Chemical Mechanical Polishing, or cutting by the use of a diamond bit on another major surface of the conductor plate until the resin layer appears, and leaving the pattern in the resin layer as a conductor pattern.</p>
申请公布号 KR20110084525(A) 申请公布日期 2011.07.25
申请号 KR20117013143 申请日期 2009.10.15
申请人 FUJITSU LIMITED 发明人 MIZUKOSHI MASATAKA;ISHIZUKI YOSHIKATSU
分类号 H05K3/20;H05K3/22;H05K3/46 主分类号 H05K3/20
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