发明名称 LED LIGHTING MODULE AND LIGHTING DEVICE USING THE MODULE
摘要 PURPOSE: An LED lighting module and a lighting device using a module are provided to improve a heat dissipation property by making an LED package contacted to a heat sink through a metal PCB having excellent thermal conductivity. CONSTITUTION: In an LED lighting module and a lighting device using a module, a body frame(10) comprises a bent combining surface. Semicircular heat radiation fins(20) are arranged over the body excluding the optical outlet of the body frame. A metal PCB(30) is combined with the combination side of the body frame. The metal PCB directly transfers the heat from the LED package to the body frame. An LED package(40) discharges light through the power supplied through the metal PCB.
申请公布号 KR101051869(B1) 申请公布日期 2011.07.25
申请号 KR20100135181 申请日期 2010.12.27
申请人 KIM, DUK YONG 发明人 KIM, DUK YONG
分类号 F21S2/00;F21V17/00;F21V29/00;F21Y101/02 主分类号 F21S2/00
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