| 摘要 |
PURPOSE: A method for coating a light emitting diode is provided to reduce the loss due to coating errors by fixing a light emitting diode on a mount or performing a coating process before a wire bonding process. CONSTITUTION: A coating material is provided on a light emitting diode. The light which does not penetrate a bonding pad is selectively irradiated on a coating material from a multilayer semiconductor layer a bonding pad so as to form a hardened coating layer on the light emitting diode. The coating material which is not hardened is removed therefrom. The coating material formed on the bonding pad is not hardened. The light is irradiated in the vertical direction from the lower part of the multiplayer semiconductor layer to the bonding pad.
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