SOCKET APPARATUS FOR SEMICONDUCTOR MODULE

摘要

PURPOSE: A socket device of a semiconductor module is provided to install a heat emitting unit in a socket main body, thereby preventing heat generated in the semiconductor module from being transferred to the main body thereof. CONSTITUTION: A socket main body(11) comprises a socket groove corresponding to a semiconductor module. A socket pin(13) is installed in the socket groove of the socket main body to be electrically connected to a module pin of the semiconductor module. A heat emitting unit(12) is installed in the socket main body. The heat emitting unit includes a heat emitting plate which is exposed to one side of the socket main body. A socket pin is electrically connected to the main board of a computer. A ratchet is installed on both sides of the socket groove of the socket main body and has teeth engaged with a tooth groove of the semiconductor module.