发明名称 |
CARRIER FOR MANUFACTURING PRINTED BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING PRINTED BOARD USING CARRIER |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a carrier and method for manufacturing a printed board, wherein a structure of the carrier is simplified, and improving junction reliability of a circumferential part of the carrier is improved by coupling a joining means not only with a side face but also with an upper surface of a metallic layer, and also to provide a method of manufacturing the printed board using the carrier. <P>SOLUTION: The carrier for manufacturing the printed board includes: a first carrier 100a having a first joining means 102 and a first metallic layer 101 formed in a first aperture 105 of the first joining means 102; and a second carrier 100b coupled with the first carrier 100a and having a second joining means 104 and a second metallic layer 103 formed in a second aperture 106 of the second joining means 104 and partially overlapping the first metallic layer 101. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011142283(A) |
申请公布日期 |
2011.07.21 |
申请号 |
JP20100048554 |
申请日期 |
2010.03.05 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
LEE JAE JOON;AN JIN YONG;CHO SUK HYEON;KIM KI HWAN;LEE SEOK KYU |
分类号 |
H05K3/46;H05K3/00 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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