发明名称 WIRING BOARD, ELECTRONIC COMPONENT MOUNTING BOARD, AND METHOD OF CHECKING SOLDERING OF THE ELECTRONIC COMPONENT MOUNTING BOARD
摘要 PROBLEM TO BE SOLVED: To check the soldered condition of a portion hidden by an electronic component, without operating the electronic component. SOLUTION: A wiring board 10 on which an electronic component 20 having a component back terminal is mounted with a mounting surface 21a opposite to a component surface 11a includes: a first pad 13 provided in a mounting position of the electronic component 20 on the component surface 11a so as to be electrically connected to a portion of the component back terminal 23 of the electronic component 20 by soldering; a second pad 14 provided in a mounting position of the component surface 11a while not being electrically connected to the first pad 13 so as to be electrically connected to another portion of the component back terminal 23 of the electronic component 20 by soldering; a first test pad 15 electrically connected to the first pad 13 and provided in the portion of the component surface 11a exposed from the electronic component 20 mounted; and a second test pad 16 electrically connected to the second pad 14 and provided in the portion of the component surface 11a exposed from the electronic component 20 mounted. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011142160(A) 申请公布日期 2011.07.21
申请号 JP20100001148 申请日期 2010.01.06
申请人 YAZAKI CORP 发明人 YAGI KENJI
分类号 H05K1/11;G01R31/04;H05K3/34 主分类号 H05K1/11
代理机构 代理人
主权项
地址