| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of simply manufacturing an electronic device that includes a process of forming a functional element directly on a flexible film. <P>SOLUTION: The method of manufacturing the electronic device includes steps of: preparing a non-flexible substrate 10 and a flexible film 20 having higher flexibility than the non-flexible substrate 10; adding an adhesive 15 only to a peripheral-part region 12 of a sticking region 11, where the flexible film 20 is to be stuck, of one surface 10a of the non-flexible substrate 10; sticking the flexible film 20 on the one surface 10a of the non-flexible substrate 10 under a vacuum condition; fabricating a structure 5 including an element having a specific function inside a cutting region 23 along a peripheral region 21 in a center-part region 22, excluding the peripheral-part region 21, on the flexible film 20; and cutting the flexible film 20 where the structure 5 is fabricated, at the cutting region 23, and peeling it from the non-flexible substrate 10. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
