| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package that provides much information with a small space and contributes to reduction in cost. SOLUTION: The semiconductor package 1 is equipped with external terminals, and the whole or a part of an external-terminal mounted surface of the semiconductor package 1 is equipped with P kinds of external terminals 2 at each of intersections of N rows and M columns, the P kinds of external terminals 2 are arranged in accordance with information imparted to the semiconductor package 1. Here, the P kinds of external terminals 2 differ in at least one of color, gloss, composition, shape, size and structure, from one another. COPYRIGHT: (C)2011,JPO&INPIT
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