发明名称 INSPECTION DEVICE BY ELECTRON BEAM, INSPECTION METHOD, AND DEVICE MANUFACTURING METHOD USING ITS INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To improve inspection speed for detecting a defect of a sample such as wafers. SOLUTION: In an electron beam test device equipped with a first electronic optical system which irradiates the electron beam to the sample to be inspected, a second optical system which makes the second beam irradiated from the wafers to a detector and a control equipment to control the detector, the electron beam test device includes a first column, a second column, and a chamber. The first column is arranged with an electron gun and the first electronic optical system. In the chamber, a stage is installed, and the sample is put thereon. At the second column, on a light axis, a cathode lens, a numerical aperture, a Wien filter, a second lens, a field aperture, a third lens, a fourth lens, and the detector are arranged. An opening part is arranged to be a focus position of the electron beam and a focal position of the cathode lens. The cathode lens and the numerical aperture constitute a telecentric electronic optical system. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011142090(A) 申请公布日期 2011.07.21
申请号 JP20110007078 申请日期 2011.01.17
申请人 EBARA CORP;TOSHIBA CORP 发明人 YAMAZAKI YUICHIRO;WATANABE KENJI;SOFUGAWA TAKUJI;NOMICHI SHINJI;SATAKE TORU;YOSHIKAWA SEIJI;KARIMATA TSUTOMU;NAKASUJI MAMORU;HATAKEYAMA MASAKI;MURAKAMI TAKESHI;NAGAHAMA ICHIROTA;NAGAI TAKAMITSU;SUGIHARA KAZUYOSHI
分类号 H01J37/29;H01J37/09;H01J37/22;H01J37/244;H01J37/28;H01L21/66 主分类号 H01J37/29
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