| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component device which prevents thermal diffusion when soldering, with a simple configuration, and at the same time, improves the high frequency characteristics of a high frequency device. SOLUTION: The electronic component device is equipped with: a high frequency electronic component 4 having a ground terminal 4a; a dielectric substrate 1 in the front surface of which a high frequency electronic component 4 is mounted in a predetermined position, while having a ground pattern 5 in the rear surface thereof; a strip line 2 installed in the dielectric substrate 1; a surface ground conductor 3 installed along the strip line 2; a slit portion formed removing a part of the surface ground conductor 3 so as to surround the ground terminal 4a, while being provided in the direction of the surface ground conductor 3 from the predetermined position; a through hole portion 6 which electrically connects the surface ground conductor 3 and the ground pattern 5, being installed in a region surrounded by the slit portion; and an electrical connection means 7 which electrically connects the ground terminal 4a with the region surrounded by the slit portion. COPYRIGHT: (C)2011,JPO&INPIT
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