发明名称 |
MANUFACTURING A SEMICONDUCTOR DEVICE |
摘要 |
There is provided a semiconductor device including: a semiconductor substrate; a gate insulating film formed on the semiconductor substrate; a work function control layer formed on the gate insulating film; a first silicide layer formed on the work function control layer; a polysilicon gate electrode formed on the first silicide layer; and a source region and a drain region formed on opposite sides of a region under the polysilicon gate electrode in the semiconductor substrate.
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申请公布号 |
US2011175172(A1) |
申请公布日期 |
2011.07.21 |
申请号 |
US201113010233 |
申请日期 |
2011.01.20 |
申请人 |
RENESAS ELECTRONICS CORPORATION |
发明人 |
MATSUKI TAKEO |
分类号 |
H01L27/092;H01L21/8238;H01L29/78 |
主分类号 |
H01L27/092 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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