发明名称 MANUFACTURING A SEMICONDUCTOR DEVICE
摘要 There is provided a semiconductor device including: a semiconductor substrate; a gate insulating film formed on the semiconductor substrate; a work function control layer formed on the gate insulating film; a first silicide layer formed on the work function control layer; a polysilicon gate electrode formed on the first silicide layer; and a source region and a drain region formed on opposite sides of a region under the polysilicon gate electrode in the semiconductor substrate.
申请公布号 US2011175172(A1) 申请公布日期 2011.07.21
申请号 US201113010233 申请日期 2011.01.20
申请人 RENESAS ELECTRONICS CORPORATION 发明人 MATSUKI TAKEO
分类号 H01L27/092;H01L21/8238;H01L29/78 主分类号 H01L27/092
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