METHOD FOR DEPOSITING A PALLADIUM LAYER SUITABLE FOR WIRE BONDING ON CONDUCTORS OF A PRINTED CIRCUIT BOARD AND PALLADIUM BATH FOR USE IN SAID METHOD

摘要

The invention relates to a method for generating a surface that can be bonded with gold wire. Said surface is obtained by first depositing an exchange palladium layer made of the electrolyte according to the invention on conductors of printed circuit boards, in particular on conductors made of copper or conductive paste. Said exchange palladium layer is then reinforced with a palladium layer, deposited from a chemical palladium electrolyte. In order to protect the palladium, an exchange gold layer is then applied. According to the invention, an exchange palladium bath is used, comprising an organic brightener.