Formation e.g. of quad no-lead frame integrated circuit package by forming solder coating on side surface of terminal of integrated circuit package while covering underside of terminal of package

摘要

Formation of integrated circuit (IC) package (200) comprises removing oxides (210) from a side surface (122-1) of a terminal of the IC package; covering an underside of the terminal (220) of the IC package; and forming a solder coating (230) on the side surface of the terminal of the IC package while covering the underside of the terminal of the IC package. An independent claim is included for processing IC packages (101-1).