SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SAME

摘要

A semiconductor device comprises a first semiconductor chip (111) on which a first semiconductor element having a plurality of element electrodes (113) is formed and a first substrate (101) on the element mounting surface (101A) of which the first semiconductor chip (111) is mounted. The first substrate (101) has: a plurality of first electrodes (104) formed on the element mounting surface (101A) and a plurality of first wires connected to the first electrodes (104); a plurality of second electrodes (107) formed on the surface (101B) on the opposite side of the element mounting surface (101A) and a plurality of second wires connected to the second electrodes (107); and a plurality of through-wires (109) passing through the first substrate (101) and connecting the first wires and the second wires. A first side of the first substrate (101) is shorter than a first side of the first semiconductor chip (111).