| 摘要 |
A manufacturing method of a piezoelectric device includes: forming a lid for sealing a cavity of a package base by forming a recess part and forming a through hole in an inner surface of the recess part in a metal plate; fixing the lid to the package base containing a piezoelectric vibrating reed so that the recess part may project toward the package base side; providing a metal piece in the recess part; decompressing the cavity via the through hole; and closing the through hole by applying a laser to the metal piece to melt the metal piece, wherein, at forming of the lid, the through hole is formed in a direction orthogonal to a thickness direction of the metal plate.
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