WAFER UNLOADING SYSTEM AND WAFER PROCESSING EQUIPMENT INCLUDING THE SAME

摘要

Provided are a wafer unloading system and a wafer processing equipment including the same. The wafer unloading system includes a fluid supply tube for supplying a fluid, a nozzle for injecting the supplied fluid, and an injection hole defined in a plate to allow the injected fluid to reach a space between a polishing pad and a wafer.