发明名称 METHOD OF MANUFACTURING SUBSTRATE WITH BUILT-IN CAPACITOR
摘要 <p>Disclosed is a method of manufacturing a substrate with a built-in capacitor, wherein a process for mounting capacitor elements upon an insulating base material is simplified. The method of manufacturing a substrate with a built-in capacitor is provided with a pasting process, a peeling-off process, and a laminating process. In the pasting process, an element attached sheet (8) is created, using a sheet (80) that can have capacitor elements (1) pasted on or peeled off by applying external action thereto, and by pasting on and attaching the capacitor element (1) onto one or a plurality of prescribed areas within the surface of the sheet (80). In the peeling-off process, the capacitor elements (1) are peeled off from the sheet (8) and mounted onto the insulating base material (20), by superimposing the element attached sheet (8) onto a prescribed position of the insulating base material (20), with the element attached sheet (8) taking a posture of having the capacitor elements (1) attached thereto facing the insulating base material (20), and applying an external action onto the element attached sheet (8) at that state to peel off the capacitor elements (1). In the laminating process, an insulating substrate is formed by laminating another insulating base material (20) upon the insulating base material (20).</p>
申请公布号 WO2011086797(A1) 申请公布日期 2011.07.21
申请号 WO2010JP71976 申请日期 2010.12.08
申请人 SANYO ELECTRIC CO., LTD.;TANAKA NAOKI;EZAKI KENICHI;NIKI KAZUYA;NOGUCHI HITOSHI;MAEDA SHINGO 发明人 TANAKA NAOKI;EZAKI KENICHI;NIKI KAZUYA;NOGUCHI HITOSHI;MAEDA SHINGO
分类号 H05K3/46;H01G4/12;H01L23/12;H05K1/16 主分类号 H05K3/46
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