| 摘要 |
<p>Disclosed is a three-dimensional packaging method for sequentially laminating a plurality of upper layers to be joined including feedthrough electrodes on a lowest layer to be joined including electrodes while the positions of the electrodes are adjusted with respect to each other, which comprises recognizing positions for alignment on the lowest layer to be joined; and sequentially adjusting the positions of all the upper layers to be joined at predetermined positions where the electrodes are sequentially connected with reference to the recognized positions for alignment on the lowest layer to be joined, and sequentially laminating the upper layers to be joined disposed at the predetermined positions. Also disclosed is a three-dimensional packaging device. Since all the upper layers to be joined are sequentially positioned and laminated with reference to the recognized positions on the lowest layer to be joined, the need for reading the upper surfaces of the upper layers to be joined, which are not easily read using conventional technology, is eliminated, and the layers can be easily and accurately positioned. As a result, packaging accuracy is significantly improved, and reliability of highly accurate three-dimensional packaging is also improved.</p> |
