WAFER UNLOADING SYSTEM AND WAFER DOUBLE SIDE PROCESSING EQUIPMENT INCLUDING THE SAME

摘要

PURPOSE: A wafer unloading system and a device for processing both surfaces of a wafer including the same are provided to reduce surface tension between a pad and a wafer after a polishing process by moving fluid to the lower surface plate of a double side polishing device or lapping device. CONSTITUTION: A fluid supply tube(20) supplies fluid. A nozzle(23) sprays the supplied fluid. A spray hole(22) is formed on a lower surface plate(12) to send the fluid between a polishing pad(14) and a wafer. A nozzle pipe(21) moves the fluid to the spray hole. The fluid supply tube and the nozzle are formed on the lower surface plate.