发明名称 |
WAFER UNLOADING SYSTEM AND WAFER PROCESSING EQUIPMENT INCLUDING THE SAME |
摘要 |
A wafer unloading system and wafer processing equipment (system) including the same are disclosed. The wafer unloading system includes a fluid supply tube for supplying a fluid, a nozzle for injecting the supplied fluid, and an injection hole defined in a plate to allow the injected fluid to reach a space between a polishing pad and a wafer. |
申请公布号 |
US2011177762(A1) |
申请公布日期 |
2011.07.21 |
申请号 |
US201113008896 |
申请日期 |
2011.01.18 |
申请人 |
AHN JIN-WOO;CHOI EUN-SUCK;KIM BONG-WOO;YU HWAN-SU;YI JAE-HWAN |
发明人 |
AHN JIN-WOO;CHOI EUN-SUCK;KIM BONG-WOO;YU HWAN-SU;YI JAE-HWAN |
分类号 |
B24B7/00;B24B37/34;B65G51/01 |
主分类号 |
B24B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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