| 摘要 |
PROBLEM TO BE SOLVED: To promote an increase of pins by improving a manufacturing yield of a QFN (Quad Flat Non-leaded package). SOLUTION: A resin sealing body 3 for sealing a semiconductor chip 2 is molded, thereafter both the peripheral part of the resin sealing body 3 and a lead frame LF<SB>1</SB>are cut along cut lines C located at inner sides (center side of resin sealing body 3) relative to lines (mold lines) along outer edges of the resin sealing body 3, and thereby entire circumferences (upper surfaces, lower surfaces and both side surfaces) of leads 5 exposed to side surfaces (cut surfaces) of the resin sealing body 3 are brought into states that they are covered with resins, whereby no metal burr is generated on cut surfaces of leads 5. COPYRIGHT: (C)2011,JPO&INPIT
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