发明名称 DESIGN DRIVEN INSPECTION OR MEASUREMENT
摘要 PROBLEM TO BE SOLVED: To provide design driven inspection/metrology methods and apparatus in semiconductor wafer defect inspection or measurement. SOLUTION: A recipe 155 is a set of instructions including wafer processing parameters, inspection parameters, or control parameters for telling an inspection/metrology system 150 how to inspect/measure a wafer 160. Design data is imported into a recipe extraction system 150, and the recipe extraction system 150 recognizes instances of target structures and configures recipe parameters accordingly, thereby reducing manual instrument setup time, improving inspection/measurement accuracy, and improving fabrication efficiency. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011142299(A) 申请公布日期 2011.07.21
申请号 JP20100210242 申请日期 2010.09.17
申请人 KLA-TENCOR CORP 发明人 BEVIS CHRISTOPHER F
分类号 H01L21/02;H01L21/66;G03F7/20 主分类号 H01L21/02
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