| 摘要 |
PROBLEM TO BE SOLVED: To improve bonding performance of an ultrasonic bonding device using ultrasonic vibration. SOLUTION: The ultrasonic bonding device has a hollow and rod-like bonding tool 16 in which a hollow passage is formed in the interior, and a suction unit for suction-holding a semiconductor chip 5 is formed on one end side, a rod-like ultrasonic horn 23 for holding the bonding tool 16 and transmitting ultrasonic vibration caused in an ultrasonic generation source to the bonding tool 16, a block 32 which is attached to the other end side of the bonding tool 16, and in which a second hollow passage whose one end side is communicated with the hollow passage, and the other end side is connected to a vacuum generating unit, is formed in the interior, and a pressing member 35 for restricting the movement of the block 32 to a direction in which a connected state between the block 32 and the bonding tool 16 is changed. COPYRIGHT: (C)2011,JPO&INPIT
|
