LIQUID-COOLED INTEGRATED SUBSTRATE AND METHOD FOR MANUFACTURING LIQUID-COOLED INTEGRATED SUBSTRATE

摘要

Provided is a liquid-cooled integrated substrate which has reduced warp (shape deformation) and is excellent in strength and heat radiation. In the liquid-cooled integrated substrate (1) in which a metal circuit board (15) made of aluminum or an aluminum alloy is bonded to one surface of a ceramic substrate (10), one surface of a metal base plate (20) which has a flat plate shape and is made of aluminum or an aluminum alloy is bonded to the other surface of the ceramic substrate (10), and a liquid-cooled heat radiator (30) formed of an extrusion material is bonded to the other surface of the metal base plate (20), the relationship between a thickness (t1) of the metal circuit board (15) and a thickness (t2) of the metal base plate (20) satisfies t2/t1 = 2, the thickness (t1) of the metal circuit board (15) is 0.4 to 3 mm, and the thickness (t2) of the metal base plate (20) is 0.8 to 6 mm.