SEMICONDUCTOR SUBSTRATE PLANARIZATION APPARATUS AND PLANARIZATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a planarization apparatus that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants.

SOLUTION: The planarization apparatus 1 houses various mechanism elements in a semiconductor substrate loading/unloading stage chamber 11a, a rear-surface polishing stage chamber 11c, and a rear-surface grinding stage chamber 11b. The throughput time of a rear-surface polishing stage 70 that simultaneously polishes two substrates is designed to be about double the throughput time of a rear-surface grinding stage 20 that grinds one substrate.

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