发明名称 ANISOTROPIC CONDUCTIVE FILM, CONNECTING METHOD, AND CONNECTING STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To connect a flexible printed board containing a compound having a polar group with an alkali glass substrate at low temperatures with satisfactory adhesive force. <P>SOLUTION: The anisotropic conductive film 21 for electrically connecting a first electronic component 11 having a terminal 10 formed thereon to a second electronic component 13 having a terminal 12 formed thereon includes: a conductive particle-containing layer 22 containing a radical hardener, an acrylic resin, an epoxy resin and conductive particles 20; and an insulating adhesive layer 23 containing a cationic hardener, an epoxy resin, an acrylic resin, and a radical hardener. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011142103(A) 申请公布日期 2011.07.21
申请号 JP20110088457 申请日期 2011.04.12
申请人 SONY CHEMICAL &amp, INFORMATION DEVICE CORP 发明人 ASABA YASUHIRO;MATSUSHIMA TAKAYUKI;SATO DAISUKE
分类号 H01R11/01;C09J7/00;C09J9/02;C09J11/06;C09J133/00;C09J163/00;H01B5/16;H01R43/00;H05K1/14 主分类号 H01R11/01
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