发明名称 |
ANISOTROPIC CONDUCTIVE FILM, CONNECTING METHOD, AND CONNECTING STRUCTURE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To connect a flexible printed board containing a compound having a polar group with an alkali glass substrate at low temperatures with satisfactory adhesive force. <P>SOLUTION: The anisotropic conductive film 21 for electrically connecting a first electronic component 11 having a terminal 10 formed thereon to a second electronic component 13 having a terminal 12 formed thereon includes: a conductive particle-containing layer 22 containing a radical hardener, an acrylic resin, an epoxy resin and conductive particles 20; and an insulating adhesive layer 23 containing a cationic hardener, an epoxy resin, an acrylic resin, and a radical hardener. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
申请公布号 |
JP2011142103(A) |
申请公布日期 |
2011.07.21 |
申请号 |
JP20110088457 |
申请日期 |
2011.04.12 |
申请人 |
SONY CHEMICAL &, INFORMATION DEVICE CORP |
发明人 |
ASABA YASUHIRO;MATSUSHIMA TAKAYUKI;SATO DAISUKE |
分类号 |
H01R11/01;C09J7/00;C09J9/02;C09J11/06;C09J133/00;C09J163/00;H01B5/16;H01R43/00;H05K1/14 |
主分类号 |
H01R11/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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