SOLDER DAM FORMING APPARATUS AND SOLDER DAM FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To improve accuracy in forming a solder dam or to form a precise solder dam in regard to a solder dam forming apparatus and a solder dam forming method.

SOLUTION: The solder dam forming apparatus 10 for forming the solder dam on a lead 1 of an electronic component includes a wire material 7 transferring an ink material for preventing adhesion of a solder, to the lead 1; a wire material conveying means 5 conveying the wire material 7 along the surface of the lead 1; and an ink material supply means 6 supplying the ink material to the wire material 7.

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