| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for semiconductor and a method of manufacturing the same such that man-hours can be decreased and a broken piece of an adhesive layer is prevented from being mixed; to provide a semiconductor device that uses the adhesive film; and to provide a method of manufacturing the semiconductor device. SOLUTION: The adhesive film for semiconductor includes a peeling base A; and a laminate, in a predetermined shape, composed of an adhesive layer disposed on the peeling base A and having a predetermined plane shape, and a pressure-sensitive adhesive layer formed covering the adhesive layer and coming into contact with the peeling base A at a periphery of the adhesive layer, a plurality of laminates being dispersion-arranged on the peeling base A in a length direction. The adhesive film for semiconductor is formed by applying and drying, on the peeling base A, adhesive layers in the same shape and at constant intervals intermittently in the length direction. COPYRIGHT: (C)2011,JPO&INPIT |
