| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the occurrence of a residue of a dry photoresist as a mask for forming an electrode for external connection. <P>SOLUTION: A base metal layer 13A is formed on a semiconductor wafer 1, and cylinders 21 are formed on the base metal layer 13A. A photoresist film 43 made of a dry photoresist and having openings 43a communicating with the cavities of the cylinders 21 is formed on the cylinders 21. Electrodes 22 for external connection each having one portion provided in the cavity of the cylinder 21 and the other portion provided to protrude from a top surface 21a of the cylinder 21 are formed by electrolytic plating with the base metal layer 13A serving as a current path. <P>COPYRIGHT: (C)2011,JPO&INPIT |
