| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin film deposition apparatus that can be simply applied to produce large-sized substrates on a mass production scale and that improves the manufacturing yield. <P>SOLUTION: The thin film deposition apparatus for depositing a thin film on a substrate includes a vapor deposition source that discharges a vapor deposition material, a vapor deposition source nozzle unit disposed at one side of the vapor deposition source forming a plurality of vapor deposition source nozzles along a first direction, and a patterning slit sheet disposed opposite to the vapor deposition source nozzle unit forming a plurality of patterning slits along a second direction orthogonal to the first direction. The vapor deposition is performed while the substrate moves relative to the thin film deposition apparatus along the first direction, and the vapor deposition source, the vapor deposition source nozzle unit, and the patterning slit sheet are formed integrally with each other. <P>COPYRIGHT: (C)2011,JPO&INPIT |
