| 摘要 |
PROBLEM TO BE SOLVED: To surely remove chips easily remaining on the periphery and end faces of a substrate without damaging the substrate. SOLUTION: The washing tray 1 of the substrate A is formed by integrating a set tray 2 storing the substrate A in a storing part 5 formed by stretching linear materials 7 with a net tray 9 formed by stretching a plurality of linear materials 11, and rockably holds the substrate A stored in the storing part 5 of the set tray 2. Therefore, even if the substrate rocks greatly in the storing part by a high pressure blown washing medium, the impact to the substrate is sufficiently buffered by the linear materials stretched in both trays, causing no damage to the substrate, to surely remove the chips attached to the periphery and end faces of the substrate. COPYRIGHT: (C)2011,JPO&INPIT
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