发明名称 |
SOLDER PILLARS IN FLIP CHIP ASSEMBLY |
摘要 |
A semiconductor packaging system includes a semiconductor die and a solder pillar on a side of the semiconductor die extending outwardly from a side of the semiconductor die. The solder pillar electrically couples to an electrical contact of a packaging substrate, even when access to the electrical contact is limited by a mask. |
申请公布号 |
WO2011088384(A2) |
申请公布日期 |
2011.07.21 |
申请号 |
WO2011US21386 |
申请日期 |
2011.01.14 |
申请人 |
QUALCOMM INCORPORATED;VARANASI, ARUN, K. |
发明人 |
VARANASI, ARUN, K. |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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