Power semiconductor module has external terminal guards that are screwed on regions of terminal tabs, so that external terminal guards are made to press contact the spring elements

摘要

The power semiconductor module (100) has power semiconductor chip arranged inside the cabinet (1). The terminal tabs (3-5) arranged inside the cabinet, are extended outside of the cabinet. The spring elements (6,7) partially arranged outside of the cabinet, are electrically connected with the associated terminal tabs (3,4). The external terminal guards are screwed on the regions (35,45) of terminal tabs, so that the external terminal guards press contact the spring elements. An independent claim is included for method for manufacturing power semiconductor module.