| 发明名称 |
RESIN COMPOSITION, AND PREPREG AND PRINTED WIRING BOARD USING THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition which is free from halogen, is excellent in chargeability into through-holes and has a low dielectric constant and to provide a prepreg and a printed wiring board using the resin composition. <P>SOLUTION: The resin composition comprises: (a) an inorganic filler having a spherical particle shape and an average particle size of 0.1 to 5μm; (b) a halogen-free thermosetting resin; (c) a halogen-free curing agent for the thermosetting resin; and (d) a halogen-free flame retardant, wherein a relative dielectric constant at frequency 1 GHz of the cured material of the resin composition is 2.5 to 3.5. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
| 申请公布号 |
JP2011140661(A) |
申请公布日期 |
2011.07.21 |
| 申请号 |
JP20110060633 |
申请日期 |
2011.03.18 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
OHASHI KENICHI;MURAI YASUHIRO;SAKAI HIROSHI;AITSU SHUJI |
| 分类号 |
C08L101/00;C08J5/24;C08K3/00;H05K1/03 |
主分类号 |
C08L101/00 |
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