| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure that can prevent the occurrence of interfacial delamination between the outer edge of a circuit board and a mold resin. <P>SOLUTION: A conductive adhesive 50 having an elastic modulus lower than that of a circuit board 10 is formed on an outer edge 11a of one surface 11 of the circuit board 10 as a stress buffer section for easing up stress received by the circuit board 10 from a mold resin 40. The conductive adhesive 50 is coated with an adhesion reinforcing material 60. When the circuit board 10 receives delamination stress from the mold resin 40, the conductive adhesive 50 and the adhesion reinforcing material 60 receive the delamination stress and are transformed. Consequently, the delamination stress to the circuit board 10 is reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
