APPARATUS INCLUDING ELECTRONIC CIRCUIT ELEMENT AND METHOD OF MANUFACTURING THE SAME, WIRING BASE MATERIAL FOR CONNECTION OF THE ELECTRONIC CIRCUIT ELEMENT, AS WELL AS WIRING BOARD WITH THE APPARATUS INCLUDING THE ELECTRONIC CIRCUIT ELEMENT AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an apparatus including an electronic circuit element that is superior in thinning and high reliability of connection and a method of manufacturing the same, to provide a wiring base material for connection of the electronic circuit element, and to provide a wiring board with the apparatus including the electronic circuit element and a method of manufacturing the same.

SOLUTION: The apparatus 19 including the electronic circuit element includes the electronic circuit element 14 such as a chip capacitor, and a conductive metal layer pattern 7 disposed beneath the electronic circuit element 14 and electronically connected while being sealed by a sealant 16. The conductive metallic layer pattern 7 is exposed in such a way as to partly protrude in its thickness direction. A conductive connection member 12 is used to connect the electronic circuit element 14 to the conductive metallic layer pattern 7.

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