发明名称 Methods of Forming Conductive Features and Structures Thereof
摘要 Methods of forming features and structures thereof are disclosed. In one embodiment, a method of forming a feature includes forming a first material over a workpiece, forming a first pattern for a lower portion of the feature in the first material, and filling the first pattern with a sacrificial material. A second material is formed over the first material and the sacrificial material, and a second pattern for an upper portion of the feature is formed in the second material. The sacrificial material is removed. The first pattern and the second pattern are filled with a third material.
申请公布号 US2011175148(A1) 申请公布日期 2011.07.21
申请号 US201113074888 申请日期 2011.03.29
申请人 发明人 YAN JIANG;HAMPP ROLAND;HAN JIN-PING;ELLER MANFRED;GUTMANN ALOIS
分类号 H01L29/772 主分类号 H01L29/772
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