METHOD OF FORMING CIRCUIT INTERCONNECTION, CIRCUIT BOARD, AND CIRCUIT INTERCONNECTION FILM HAVING FILM THICKNESS LARGER THAN WIDTH THEREOF

摘要

A method of forming a circuit interconnection on a circuit board includes: forming a trench that corresponds to a shape of the circuit interconnection on an interconnection base material that forms the circuit interconnection; distributing a catalyst for forming a conductive layer on the trench; and forming a conductive circuit interconnection film that forms the circuit interconnection by distributing a plating solution in a range that includes the trench and depositing a conductive material from the plating solution through the catalyst for forming the conductive layer.