发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME
摘要 According to one embodiment, a positive photosensitive resin composition includes a resin containing a specified acrylic acid besed-structural unit which generates a carboxyl group when its dissociative group is dissociated, which resin is insoluble in alkali or sparingly soluble in alkali but when its acid-dissociative group is dissociated, becomes soluble in alkali, a resin containing a structural unit derived from a radical-polymerizable monomer containing an epoxy group, a compound containing two or more epoxy groups in its molecule, provided that the resin containing the structural unit derived from a radical-polymerizable monomer containing an epoxy group is not included in this compound, and a compound that when exposed to actinic rays of 300 nm or longer wavelength, generates an acid.
申请公布号 US2011177302(A1) 申请公布日期 2011.07.21
申请号 US20100891558 申请日期 2010.09.27
申请人 FUJIFILM CORPORATION 发明人 TAKITA SATOSHI
分类号 B32B3/00;G03F7/004;G03F7/20 主分类号 B32B3/00
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