发明名称 |
MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MICROSCOPIC STRUCTURE |
摘要 |
A method of packaging a micro electro-mechanical structure comprises forming said structure on a substrate; depositing a sacrificial layer over said structure; patterning the sacrificial layer; depositing a SIPOS (semi-insulating polycrystalline silicon) layer over the patterned sacrificial layer; treating the SIPOS layer with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer through the porous layer SIPOS to form a cavity including said structure; and sealing the porous SIPOS layer. A device including such a packaged micro electro-mechanical structure is also disclosed.
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申请公布号 |
US2011175178(A1) |
申请公布日期 |
2011.07.21 |
申请号 |
US20100953092 |
申请日期 |
2010.11.23 |
申请人 |
NXP B.V. |
发明人 |
VAN WINGERDEN JOHANNES;EINDEN WIM VAN DEN;ROOSEN HAROLD H.;VERHEIJDEN GREJA JOHANNA ADRIANA MARIA;KOOPS GERHARD;ERNUR DIDEM;VAN BEEK JOZEF THOMAS MARTINUS |
分类号 |
H01L29/84;H01L21/20 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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