| 摘要 |
A method for fabricating a semiconductor device includes the steps of: forming a mask material film on an insulating film that is formed over a semiconductor substrate and then forming a mask pattern having a first trench formation opening and a second trench formation opening from the mask material film; forming, on the mask material film, a resist pattern having a third trench formation opening that exposes the first trench formation opening and covering the second trench formation opening; forming a first trench in the insulating film using the resist pattern and the mask pattern; and forming a second trench in the insulating film using the mask pattern after removing the resist pattern.
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