摘要 |
The present invention relates to a light-emitting device. One embodiment of the present invention relates to a light-emitting device comprising: a substrate body; a plurality of mounting units formed into a conductive thin film for covering a portion of the upper surface of the substrate body, and spaced apart from each other; a wiring pattern including a connection line formed into a width narrower than those of the mounting units so as to electrically connect the plurality of mounting units; and light sources, at least one of which is mounted on at least one mounting unit from among the plurality of mounting units. According to the light-emitting device of said embodiment of the present invention, the area of a circuit board occupied by a conductive thin film is reduced, wherein the circuit board has light sources mounted thereon, thereby minimizing the warpage of the board which might occur during a reflow process or the like. |
申请人 |
SAMSUNG LED CO., LTD.;JEONG, YOUNG SIK;KWAK, NO JUN;SHIN, CHANG HO |
发明人 |
JEONG, YOUNG SIK;KWAK, NO JUN;SHIN, CHANG HO |