SEMICONDUCTOR STRUCTURE WITH HEAT SPREADER AND METHOD OF ITS MANUFACTURE
摘要
A semiconductor structure is provided and a method for manufacturing said structure. The semiconductor structure comprises a thin film semiconductor having an active region and placed on a diamond substrate. The thin film semiconductor is preferably directly bonded to the diamond layer, or may be adhered thereto by a dielectric adhesion.
申请公布号
WO2011086550(A2)
申请公布日期
2011.07.21
申请号
WO2011IL00036
申请日期
2011.01.12
申请人
NOVATRANS GROUP SA;HOCHSTADTER, ERAN;ROULSTON, JOHN