发明名称 |
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS |
摘要 |
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
|
申请公布号 |
US2011174865(A1) |
申请公布日期 |
2011.07.21 |
申请号 |
US201113072930 |
申请日期 |
2011.03.28 |
申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
DELEY MICHAEL T.;WANG ZHIJIE;LISTER PETER M.;SOOD DEEPAK |
分类号 |
B23K31/12;G06K9/00 |
主分类号 |
B23K31/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|