| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a salient electrode for connecting electronic components having a fine, arbitrary shape, to provide an electronic packaging body using the salient electrode, and to provide a method for manufacturing the salient electrode and the electronic component packaging body. <P>SOLUTION: The salient electrode 120 formed on a terminal electrode 110 in electronic components 100 comprises a first conductor 130 formed by a transfer mold having a recess, and a second conductor 140 formed by lamination on the first conductor 130 on the terminal electrode 110 of the electronic component 100. With this configuration, the fine-pitch salient electrode 120 in an arbitrary shape can be formed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
