INKJET PRINT HEAD, WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THEREOF

摘要

PURPOSE: An inkjet print head, wafer level package for the inkjet head and method of manufacturing the head are provided to facilitate individual dicing from a wafer. CONSTITUTION: An inkjet print head comprises an ink head and a chipping preventing unit. The ink head(110) externally discharges ink with driving of a piezoelectric actuator. For the chipping preventing unit, the cutting part of the ink head is formed to have a lower height than a surface, on which a nozzle is formed. An ink tank(140) supplies ink to the ink head.