WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE

摘要

PURPOSE: A mounting substrate of a semiconductor chip and a semiconductor package with the same are provided to merge first and second conductive patterns separated by a slot by a merging pattern to reduce resistance and impedance of conductive patterns, thereby enhancing the electrical features of the semiconductor package. CONSTITUTION: A substrate(110) comprises a first surface and a second surface opposite to the first surface. A plurality of conductive patterns(140a,140b,150a,150b) is formed on the first surface of the substrate. A plurality of bonding pads(120) is respectively connected to the conductive patterns. Slots penetrate a substrate. The slots are formed on the central area of the substrate. A chip pad(210) is electrically connected to the bonding pad by a connection wire(300).