METALIZED POLYIMIDE FILM AND FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A metalizing polyimide film and a flexible circuit board using the same are provided to assure that a lead is not taken off from the polyimide film at the time of mounting IC to a circuit board even when heat of more than 400°C is added and pressurized to a circuit board and a wire bonding is applied to the circuit board. CONSTITUTION: The metalizing polyimide film and the flexible circuit board using the same have following features. A metal film of the polyimide film is selected from nickel, chrome or nickel alloy. A base metal thin film and a thin copper film are formed with a dry plating method. A thickness of the metal layer is 20 μm or less. The flexible circuit board is processed with a subtractive method or a semi-additive method by using the metalizing polyimide film.