Non-invasive thermal management processes for restoring metallic details bonded to substrates

摘要

A thermal management process for enabling the restoration of a surface (42) of a metallic detail (36) in the presence of at least one bonding material (34), comprising preparing at least one damaged area (42) on a metallic detail (36); disposing at least one thermal management component (70) upon a bonding material (34) or a surface area (39) proximate to the bonding material (34) to which the metallic detail (36) is joined; masking at least the surface area (39) and the bonding material (34) with a masking agent; and dimensionally restoring a surface of the metallic detail (36) disposed on the article at a processing temperature lower than a temperature which would degrade the bonding material (34), the substrate (32), or the bondment interface (40) therebetween.