<p>The present invention specifies a leadframe for electronic components and a corresponding manufacturing process, in which the bonding islands are formed by welding individual, prefabricated segments of a bonding-capable material onto a stamped leadframe.</p>
申请公布号
EP2345075(A1)
申请公布日期
2011.07.20
申请号
EP20090783933
申请日期
2009.10.12
申请人
TYCO ELECTRONICS AMP GMBH
发明人
GOESELE, PETER;SEGER, FRIEDRICH;SINDER, JOSEF;STIFTER, JOACHIM;WERNER, OLIVER
